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| Reply To: | TechNet E-Mail Forum. |
| Date: | Fri, 5 Sep 2003 10:37:00 -0400 |
| Content-Type: | text/plain |
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One option you may have (we had to do this to get class 3 for one customer)
is to make you stencil openings longer. As the paste melts it pulls towards
itself.
>
> James Cagle
> Tyco Printed Circuit Group-Hayward Division
>
>
> Direct: 510 476-5667
> Fax: 510 476-5601
> email: [log in to unmask]
>
-----Original Message-----
From: Dave Chapman [mailto:[log in to unmask]]
Sent: Friday, September 05, 2003 4:41 AM
To: [log in to unmask]
Subject: Re: [TN] stencil
Well, we have our first 16 mil fine pitch device, 128 pin QFP. I am worried
about printing shorts on a 6 mil stencil. Everything else on the board is 20
mil or better so 5 mil is not good idea. we normally do a 10% reduction and
round the rectangles for better release. The pad width is .7 mil, I would be
pushing 6 mil with the reductions, when our normal rule is on 20 mil pitch
do not reduce overall width to less than 9. If I don't reduce the width I'm
sure we will get shorts.
Am I going to have problems if we leave the width alone and only take the
reduction in volume garnered by rounding the rectangles?
Dave C.
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