'netters,

We are experiencing a horrendous amount of solder balling formed thru 0.45mm
vias on a specific PCB. Looking at it more closely, the balls appear to be
formed (a) solder from the bath itself or, more so (b) the reflow of solder
(from the HASL process) in the vias. A short-term solution is to mask
underneath, but is the best long term solution to have these vias tented?

Regards
Grant


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