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September 2003

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 1 Sep 2003 15:02:26 EDT
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Hi H.,
The raises two questions:
(1) where did all the soolder go to?
(2) what is you solder joint heigth under the component?
Rework should certainly NOT be the norm.
And yes, any available Ag will go into solution with the Sn in the solder,
because of the dissolution rate.

Regards,
Werner Engelmaier

In a message dated 09/01/2003 2:43:20, [log in to unmask] writes:
>Hi Werner,
>There is practically no fillet height, the solder doesn't flow the way
>it should.
>If I ad some flux to the joint and reheat the solder the solderjoint is
>improving but it is still not that great.
>The best way to make a good solderjoint is to ad fresh solder during rework.
>I was wondering if there is some truth in the reaction from Guy Ramsey
>that the Silver is leached into the Tin.

>H. Molema

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