Hi Victor,
Have you considered hydro-scanning the PWBs to determine the physical size, shape and location of the suspected delamination of the PWBs?
If you are interested, there is a company named SAIC (Science Applications International Corp) who has scanning type systems to perform this type of non-destructive evaluation process? I have used SAIC's Ultra Image IV Scanning System with great success numerous times to confirm the delamination of multi-layer PWBs prior to performing the destructive physical analysis process. SAIC's is located in New London, CT, and their web-site is: http://www.saic.com/products/inspection
Also, John Mandeville, Senior Staff Engineer is an excellent SAIC technical contact who can provide you with a wealth of information on the subject. John's telephone number is 860-442-0100.
Best regards,
faz
-----Original Message-----
From: Victor Hernandez [mailto:[log in to unmask]]
Sent: Wednesday, September 03, 2003 12:12 PM
To: [log in to unmask]
Subject: [TN] PCB delamination Evaluation
Fellow TechNetters,
Are there any case studies out there that may apply to the following request.
Can varying degrees of delamination be identified with CSAM and correlated with x-ray imaging and followed up with
destructive cross section analysis. Is it possible to see the above stated artifact on a PCBA with PBGA package.
Given: The suspected delamination induced by excessive rework, Thermal Excursion and/or too high Assembly Process Profile.
Victor,
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