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September 2003

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Subject:
From:
"Kile, Judy K (MED)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 30 Sep 2003 16:10:41 -0500
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Hello,
I am looking for potential issues with a proposed design "solution" on a
780pin BGA.

Reason for this approach
1.) reduce ground bound to this BGA by tying unused pins to gnd
2.) minimize routing layers

Proposed solution for the 1mm 780 BGA is to tie the BGA pads directly to

a gnd plane (top side assembly & plane) very similar to the dog bone
pattern.
The thermal tie will be 1 "spoke" and covered with soldermask.

There is ~25-30 unused pins that would be tied in this manner.

???
1.) What are the potential assembly issues with solution?
2.) Are there any reliability issues long term?
3.) Are there other issues with this design proposal?

Thanks for your advice,

Judy Kile
Global Electrical Technology Center
Phone: 262-548-2241
Fax: 414-908-9584

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