Wayne:
        Do you think that filling the vias with solder or with a lead and
solder will give the via more stability and keep it from tearing out?
        Just a thought.
        Ramon

> -----Original Message-----
> From: Wayne Pritchett [SMTP:[log in to unmask]]
> Sent: Monday, September 29, 2003 8:09 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] Selective Edge Plating
>
> I succeeded with an adapter board like the one you describe. I placed a
> row of vias down each edge of the board, then we routed the board outline
> right down the middle of the vias.
>
> We did get some tearout of the vias, so I suggest that you leave a little
> more than half of the via when you trim the edges. Maybe put some pads on
> inner layers to anchor the vias better. Be sure and use a mild flux.
>
> Wayne Pritchett
>
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