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September 2003

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 24 Sep 2003 18:11:50 EDT
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Hi Wei,
What you and I have said is the same thing.

Werner

In a message dated 09/24/2003 16:39:21, [log in to unmask] writes:
>Hi,
>I think the other important reason to use high-temp solder sphere on CBGA
>is because of the big CTE difference between FR-4 and ceramic. It provide
>more flexible joint. Same
>reason as IBM CCGA packages which use high-temp solder column.
>Wei Wang
>
>Werner Engelmaier wrote:
>> Hi Victor,
>> The reason for high-melt solder balls is the same as for solder
>> columns--thicker solder connections (higher stand-off heights) provide
>higher reliability
>> roughly by the square of the heights. This is well documented--just take
>one of
>> my workshops.
>>
>> Regards,
>> Werner Engelmaier

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