It just so happens that we build a multi-chip module using a 625-BGA
package.  We buy the empty package from Kyocera, install multiple die and
discretes, seal the lid, attach the balls (4 hi-temp in the corners) and
solder the BGA to our PWB.

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879


        -----Original Message-----
        From:   Steve Gregory [SMTP:[log in to unmask]]
        Sent:   Wednesday, September 24, 2003 3:25 PM
        To:     [log in to unmask]
        Subject:        Re: [TN] 5Sn / 95Pb Solder Sphere

        Jim,

        Do you get the devices like that, or do you put the hi-temp balls in
the corners yourself?

        Thanks!

        -Steve Gregory-




                Victor, we use high temp solder balls on the 4 corners of a
625 ceramic BGA.
                The main purpose is to prevent the device from collapsing,
causing solder
                bridging.  Maintaining the stand-off height after reflow
also increases long
                term reliability.

                Jim Marsico
                Senior Engineer
                Production Engineering
                EDO Electronics Systems Group
                [log in to unmask] <mailto:[log in to unmask]>
                631-595-5879




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