Jim,

Some component lead-free finishes are not compatible with current tin/lead assembly processing.  Bismuth can weaken tin-lead solder joints.  Tin finishes should only be matte (no brighteners) or fully annealed (low stress to ensure against tin whiskers that can ruin satellites and can cause fires).

Regards,

Karl Sauter             Staff Engineer, Engineering Technologies
                        Sun Microsystems Inc.
                        Phone: 650-786-7663
                        Email: [log in to unmask]

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