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September 2003

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Subject:
From:
Tom Gervascio <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 3 Sep 2003 14:23:45 -0400
Content-Type:
text/plain
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text/plain (136 lines)
Don't have an experience with CSAm- I know that by the nature of solder
sphere deformations and bridges in the center of reflowed PBGAs that we
can infer if the BGA popcorned. The center spheres typically will be
displaced outware radially from the center and show bridges yet the
peripheral solder spheres will not bridge and will solder acceptably.

Tom Gervascio
Senior Process Engineer
Sparton Electronics
(352) 540-4040

>>> [log in to unmask] 09/03/03 01:48PM >>>
Bev,

    Thanks for your insight on the above stated issue.   I too was not
aware
that CSAM could identify de-lamination on PCB laminate.

Victor.

-----Original Message-----
From: Bev Christian [mailto:[log in to unmask]]
Sent: Wednesday, September 03, 2003 12:13 PM
To: [log in to unmask]
Subject: Re: [TN] PCB delamination Evaluation


Victor,
I stand to be corrected, but to my understanding you cannot use CSAM
for
PCBs because the glass fibers disperse the signal and no useful
information
can be collected.  X-ray would be tough.  Unless you can correlate
distance
between internal traces examined at an oblique angle, I can't see how
you
could use x-rays for this problem.  Sometimes nothing replaces
cross-sectioning.
regards,
Bev Christian
Research in Motion

-----Original Message-----
From: Victor Hernandez [mailto:[log in to unmask]]
Sent: September 3, 2003 12:12 PM
To: [log in to unmask]
Subject: [TN] PCB delamination Evaluation



Fellow TechNetters,

   Are there any case studies out there that may apply to the
following
request.

   Can varying degrees of delamination be identified with CSAM and
correlated with x-ray imaging and followed up with
destructive cross section analysis.   Is it possible to see the above
stated
artifact on a PCBA with PBGA package.

   Given:  The suspected delamination induced by excessive rework,
Thermal
Excursion and/or too high Assembly Process Profile.

Victor,

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