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September 2003

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Subject:
From:
Karl Sauter <[log in to unmask]>
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Date:
Wed, 24 Sep 2003 11:58:35 -0700
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Dave,

This is still an open issue.  The new phenolic type catalyst cured FR-4 epoxy laminate materials (not dicyandiamide cured) generally are much more thermally robust and reliable.

The EU RoHS law driving the lead-free effort does not require the use of halogen-free PCB Fab laminate materials.  The commonly used Tetrabromobisphenol A (TBBPA) flame retardant ingredient is NOT included.  Note: This chemically bound TBBPA has not been shown to be hazardous (studies are available) and it imparts superior recycling properties to the laminate material.  Also there are PCB reliability issues associated with the use of phosphorus in laminate materials (some alternate flame
retardant materials contain phosphorus).

Regards,
Karl Sauter

Dave Chapman wrote:
>
> Everything on Lead Free so far has been focusing on the solder and the board
> finishes. Is there any concern with the FR-4 material and TG of exposure to
> the higher processing temps for Lead Free?
> Dave Chapman
> Manufacturing Engineer
> Circuit Service Inc.
>
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Karl Sauter             Staff Engineer, Engineering Technologies
                        Sun Microsystems Inc.
                        Phone: 650-786-7663
                        Email: [log in to unmask]

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