 
| Subject: | |
| From: | |
| Reply To: | TechNet E-Mail Forum. |
| Date: | Wed, 24 Sep 2003 12:59:21 -0400 |
| Content-Type: | text/plain |
| Parts/Attachments: |
|
|
Victor, we use high temp solder balls on the 4 corners of a 625 ceramic BGA.
The main purpose is to prevent the device from collapsing, causing solder
bridging. Maintaining the stand-off height after reflow also increases long
term reliability.
Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879
-----Original Message-----
From: Victor Hernandez [SMTP:[log in to unmask]]
Sent: Wednesday, September 24, 2003 9:46 AM
To: [log in to unmask]
Subject: [TN] High Temp Solder Sphere ( 5Sn / 95Pb)
Importance: High
Fellow TechNetters:
My initial request was returned. Therefore, I restated my inquiry
regarding High Temp.Solder Spheres Application
Victor,
-----Original Message-----
From: Hernandez, Victor G
Sent: Wednesday, September 24, 2003 7:10 AM
To: [log in to unmask]
Subject: [TN] 5Sn / 95Pb Solder Sphere
Importance: High
Fellow TechNetters:
What is your experience with HIGH Temp Solder Sphere (Sn05Pb95).
BGA or Micro Bump.
What is the primary USAGE and WHY.
Is there any Reliability Documentation out there for this
application?
Victor,
---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV
1.8e
To unsubscribe, send a message to [log in to unmask] with following
text in the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information,
or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV
1.8e
To unsubscribe, send a message to [log in to unmask] with following
text in the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information,
or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV
1.8e
To unsubscribe, send a message to [log in to unmask] with following
text in the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information,
or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
|
|
|
