Lead Free System—Part I: Lead-free Interconnections--Technology and Manufacturing
October 29, 2003 ♦ Holiday Inn Select Seattle-Renton ♦ Renton, WA
The purpose of the course is to provide broad-based information, as well as specific critical factors for the implementation of lead free manufacturing. Environment-friendly manufacturing and end-use products that are ultimately safer at the end of life cycle are essential to technology-business competitiveness. This workshop will cover global legislative status, technological base, product assessment and manufacturing considerations.
Topics to be Covered
• Driving forces
• Legislation update–US, Japan, Europe
• Pb-free criteria & definition
• Pb-free technological base & comparison of viable Pb-free alloy options
• Global implementation status
• Pb-free BGA, CSP, and flip chip solder ball performance
• Pb-free SMT manufacturing in reflow and wave soldering vs. alloy melting temperature
• Pb-free SMT manufacturing—intrinsic wetting
• Alloy selection--critical criteria
• Optimal reflow profiling vs. Pb-free system reliability
• High fatigue-resistant Pb-free alloys
• Differentiation of solder joint failure modes between SnPb and Pb-free
• Manufacturing factors - cost vs. performance
• Fillet-lifting—causes and solutions
• Pb contamination effects
• Recommendations
To download the registration form, go to http://ipcmail.ipc.org/wkshp_12/wkshp_12.html, or contact Nilda Mendez at [log in to unmask] or via phone at 847-790-5329.
Lead Free System—Part II: Lead Free Components & PCB Surface Finish
October 29, 2003 ♦ Holiday Inn Select Seattle-Renton ♦ Renton, WA
This course will provide an understanding of the important factors that determine the solderability and performance of surface finishes and component coatings under SMT manufacturing. The viable material and process options of PCB surface finish and component lead-coating will be separately reviewed. The instructor will discuss the role of intermetallics and gold, tin whisker, black pad issue and Bi effects.
Topics to be Covered
•Purpose of surface finish and lead coating
•Solderability-principle & definition
•Viable options of Pb-free component lead coating/terminations
•Role of intermetallic to solderability and in Pb-free solder joints
•Role of gold, palladium to solderability and in Pb-free solder joints
•Tin whisker – phenomena, factors
•Viable options of Pb-free PCB surface finishes
•Characteristics of various Pb-free surface finish systems
•Organic coating (OSP) vs. metallic
•Relative performance of Pb-free surface finishes with Pb-free solder joints
•BGA Black-pad—causes and solutions
•Bi effects
•Discussions on compatibility issues in Pb-free system
•Recommendations
To download the registration form, go to http://ipcmail.ipc.org/wkshp_13/wkshp_13.html, or contact Nilda Mendez at [log in to unmask] or via phone at 847-790-5329.
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