Alexandra, we at ATC are very interested in this issue because of the

number of components we are beginning to produce with the pure tin coating

on them..    At this time we do not have anything to contribute but would

like to attend to gain what  I can only assume will be valuable

information.   Please keep me informed on how registration will be

accomplished.



Thank you



Jim TerVeen





                                                                                                           

                      Alexandra Curtis                                                                     

                      <AlexandraCurtis@        To:       [log in to unmask]                                   

                      IPC.ORG>                 cc:                                                         

                      Sent by: TechNet         Subject:  [TN] IPC Seeking Industry Experts on Tin Whiskers 

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IPC is CALLING FOR YOUR PARTICIPATION AT THE......



International Conference on Tin Whiskers: The Unexplained Phenomenon

Technical Conference and Tabletop Exhibits: November 5-6, 2003

Holiday Inn Research Park ● Huntsville, AL



What is Tin Whiskers you say? Tin whiskers are single crystal structure of

tin that grows unexpectedly from the surface of pure tin, especially

electroplated tin. Tin whiskers are thought to be a “mechanical phenomenon”

but this is no new phenomenon. The first published report of tin whiskers

dates back to the 1940’s.



Component manufacturers are being driven to eliminate lead from electronics

and consider pure tin coatings as an economical lead free plating option.

It has been rumored that electronic component manufacturers have announced

plans to increase the use of pure-tin coatings on leads and other external

and internal surfaces.



Years of study have been conducted regarding the mechanisms in which tin

whiskers grow and still not a single acceptable explanation for this

phenomenon exists. If the industry is going to demand the use of pure tin

coats, it’s time to investigate the phenomenon of tin whiskers.



Potential topics for presentations at the Tin Whiskers conference are:



• Whisker Failures

• Reliability issues

• Intermetallic Formation

• Compressive Stresses

• Risk/Failure Mechanisms

• Debris/Contamination

• Environmental Factors

• Case Studies

• Plating Options/Solutions

• Accelerating Test Conditions

• Whisker Metallization



The International Conference on Tin Whiskers offers time slots between

30-45 minutes long. To submit an abstract, please include an abstract of

200-300 words describing the presentation you wish to have considered,

along with a brief biography and e-mail to [log in to unmask]