TECHNET Archives

September 2003

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Franklin D Asbell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 19 Sep 2003 15:19:10 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (34 lines)
OSP

pro- excellent solderability, especially for small, tight packages
pro- flat solderable surface

con- must be used rather quickly, low shelf-life
con- handling procedures should be in place, contaminates easily
con- may require significant process changes

HASL

pro- solderability is good, often even without pre-cleaning
pro- often no major change is required of processes (existing process does
not need modification)
pro- long shelf-life (in some cases...years)

con- not a very flat surface
con- often find solder shorts after assembly
con- not good for tight pitch product (for the baove reasons)

These are I'm sure only a few issues...but probably the most significant

Franklin

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2