TECHNET Archives

September 2003

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Potential Problems with Mold Compound
From:
"Creswick, Steven" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 19 Sep 2003 09:55:05 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (19 lines) 
Had anyone seen this yet.  It just came to my attention this morning.

<http://www.maxim-ic.com/TechSupport/QA/Reliability/SumitomoNote.pdf>

I wonder just how much (other) product has been manufactured with this particular mold compound, and how many under-explained failures it will generate?


Steven Creswick - Gentex Corporation

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2