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September 2003

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Subject:
From:
Eddie Rocha <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 18 Sep 2003 13:53:29 -0700
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text/plain (62 lines)
These type of shorts are mainly due to either improper
inner layer etching (clearing the copper from inner layer
clearance pads) or drill to inner layer mis-registration.
If many shorts are detrected on the same board, that
typically points to mis-registration. Hope this helps.

Eddie Rocha
Director of Engineering
(408) 978-8992 x282

Hi Technetters,

Can any of the technical Gurus from the PWB Fab or related
industry
enlighten how & why the inner-layer power/GND shorts occur
& how they can
be detected after the boards have been laminated. Of course
I do understand
that when you are building boards with very tight
tolerances, fine lines
thin cores the probability of these type of shorts
occurring is quite high.
However we have days when we have zero GND shorts & days
with upto 5%. We
have looked into all potential problems, but maybe we are
still missing out
something, so if someone out there can enlighten me it will
be very much
appreciated.

Thanks,
Krishnan.C
Sanmina-SCI

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