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| Reply To: | TechNet E-Mail Forum. |
| Date: | Fri, 12 Sep 2003 14:57:19 -0400 |
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Guy,
In my previous life I used a batch type vacuum reflow system from Scientific Sealing Technology (http://www.sstinternational.com/index.html)
It worked super-well for large, and dense power packages. Void free solder joints were much easier to produce with this equipment using a combination of vacuum and pressure during various stages of reflow. It also works well for tiny stuff. Max temp capability was something like 600C+, but never had to go over ~425C for any reason. Played with forming gas, but it never provided significant benefit over Nitrogen backfill (that I could judge at <400C).
The parts are heated by conduction from specific graphite tooling. Tooling was not cheap, but results were quite consistent - as judged by x-ray and acoustic microscopy.
Used ones are out there at the equipment re-sale places, but I would be cautious about the condition of the base electrodes and the seals. We took care of ours and got it to pump down much better than factory specs! I could see where a little bit of carelessness could end up making a mediocre system for vacuum reflow.
Steven Creswick - Gentex Corporation
Zeeland, Michigan - USA
-----Original Message-----
From: Guy Ramsey [mailto:[log in to unmask]]
Sent: Friday, September 12, 2003 2:22 PM
To: [log in to unmask]
Subject: [TN] Vacuum Furnace
We are looking for a manufacture with vacuum furnace in PA (preferably
Phila) that can assist with power module assembly using high temp
solder.
Thanks......!!!
Chris Thierolf
Electrical Engineer
American Competitiveness Institute
E-Mail: [log in to unmask]
Ph: (610) 362-1200 x212
Fax: (610) 362-1290
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