Pter,
If there is enough of a difference between the peak temperature of a proposed LM solder paste and your current paste you could:
print, place and reflow current paste with all other components
dispense LM paste, place LEDs and reflow at reflow profile appropriate for the LM paste.
Bev Christian
Research in Motion
-----Original Message-----
From: Mike McMonagle [mailto:[log in to unmask]]
Sent: September 12, 2003 8:01 AM
To: [log in to unmask]
Subject: Re: [TN] LED Soldering Query
Another option might be flame soldering. I have used it in precision
electro-mechanical applications, and will be looking at in in the future
as a potential replacement for laser soldering on PCBAs. I have found it
to be a precise, fast non-contact method of soldering delicate
components.
Mike
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of joyce
Sent: Friday, September 12, 2003 6:43 AM
To: [log in to unmask]
Subject: Re: [TN] LED Soldering Query
Peter, good call! Bonding of epoxy to solder is an issue. You may want
to use laser soldering (with your highest level of technical support and
customer service. Of course ;-).
jk
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Peter Swanson
>Sent: Friday, September 12, 2003 6:10 AM
>To: [log in to unmask]
>Subject: Re: [TN] LED Soldering Query
>
>
>Thanks Richard. Thought of this, of course, but it will somewhat depend
>on the finish on the terminations and the board. Silver loaded
>adhesives may not give a reliable enough bond to tin/lead finishes.
>
>Peter
>--
>--------------------------------------------------------
>Peter Swanson [log in to unmask]
>INTERTRONICS http://www.intertronics.co.uk
>Tel: +44 1865 842842 Oxfordshire, England
>
>INTERTRONICS is dedicated to providing quality material, consumable and
>equipment solutions to high technology assembly industries, with the
>highest levels of technical support and customer service.
>
>
>-----Original Message-----
>From: Richard Brennan [mailto:[log in to unmask]]
>Sent: 12 September 2003 10:52
>To: [log in to unmask]
>Subject: Re: [TN] LED Soldering Query
>
>
>Peter
>
>Look at the possibility of using conductive adhesive after reflow.
>
>Regards
>
>Richard Brennan
>Manufacturing Support Manager
>Health & Safety Manager
>Aerial Facilities Ltd
>Aerial House
>Asheridge Road
>Chesham
>Bucks
>HP5 2QD
>01494 777000
>Direct line
>01494 777052
>
>[log in to unmask]
>
>See us at www.aerialfacilities.co.uk
>
> -----Original Message-----
>From: Peter Swanson [mailto:[log in to unmask]]
>Sent: Friday, September 12, 2003 9:57 AM
>To: [log in to unmask]
>Subject: [TN] LED Soldering Query
>
>We have a customer who is looking at assembling some surface mount LEDs
>to a FR-4 board. We are told that the parts will not stand conventional
>reflow temperatures (they themselves are made with a LMP solder, and
>the lens is temperature sensitive). At this stage, I don't know much
>more detail.
>
>The query is whether he could print conventional paste, place the
>devices and then reflow each joint individually, by using a robot. But
>a soldering iron applied the paste will cause spitting, solder balls,
>etc.
>
>Perhaps a thermode could be applied to the joint and a temperature ramp
>up applied, which will safely reflow the paste, if such a thing exists
>and can be mounted to a robot.
>
>I would be interested in general thoughts on how to process these
>parts. Maybe not even solder...
>
>TIA,
>Peter
>--
>--------------------------------------------------------
>Peter Swanson [log in to unmask]
>INTERTRONICS http://www.intertronics.co.uk
>Tel: +44 1865 842842 Oxfordshire, England
>
>INTERTRONICS is dedicated to providing quality material, consumable and
>equipment solutions to high technology assembly industries, with the
>highest levels of technical support and customer service.
>
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