Peter, good call! Bonding of epoxy to solder is an issue. You may want
to use laser soldering (with your highest level of technical support and
customer service. Of course ;-).
jk
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Peter Swanson
>Sent: Friday, September 12, 2003 6:10 AM
>To: [log in to unmask]
>Subject: Re: [TN] LED Soldering Query
>
>
>Thanks Richard. Thought of this, of course, but it will
>somewhat depend on the finish on the terminations and the
>board. Silver loaded adhesives may not give a reliable enough
>bond to tin/lead finishes.
>
>Peter
>--
>--------------------------------------------------------
>Peter Swanson [log in to unmask]
>INTERTRONICS http://www.intertronics.co.uk
>Tel: +44 1865 842842 Oxfordshire, England
>
>INTERTRONICS is dedicated to providing quality material,
>consumable and equipment solutions to high technology assembly
>industries, with the highest levels of technical support and
>customer service.
>
>
>-----Original Message-----
>From: Richard Brennan [mailto:[log in to unmask]]
>Sent: 12 September 2003 10:52
>To: [log in to unmask]
>Subject: Re: [TN] LED Soldering Query
>
>
>Peter
>
>Look at the possibility of using conductive adhesive after reflow.
>
>Regards
>
>Richard Brennan
>Manufacturing Support Manager
>Health & Safety Manager
>Aerial Facilities Ltd
>Aerial House
>Asheridge Road
>Chesham
>Bucks
>HP5 2QD
>01494 777000
>Direct line
>01494 777052
>
>[log in to unmask]
>
>See us at www.aerialfacilities.co.uk
>
> -----Original Message-----
>From: Peter Swanson [mailto:[log in to unmask]]
>Sent: Friday, September 12, 2003 9:57 AM
>To: [log in to unmask]
>Subject: [TN] LED Soldering Query
>
>We have a customer who is looking at assembling some surface
>mount LEDs to a FR-4 board. We are told that the parts will
>not stand conventional reflow temperatures (they themselves
>are made with a LMP solder, and the lens is temperature
>sensitive). At this stage, I don't know much more detail.
>
>The query is whether he could print conventional paste, place
>the devices and then reflow each joint individually, by using
>a robot. But a soldering iron applied the paste will cause
>spitting, solder balls, etc.
>
>Perhaps a thermode could be applied to the joint and a
>temperature ramp up applied, which will safely reflow the
>paste, if such a thing exists and can be mounted to a robot.
>
>I would be interested in general thoughts on how to process
>these parts. Maybe not even solder...
>
>TIA,
>Peter
>--
>--------------------------------------------------------
>Peter Swanson [log in to unmask]
>INTERTRONICS http://www.intertronics.co.uk
>Tel: +44 1865 842842 Oxfordshire, England
>
>INTERTRONICS is dedicated to providing quality material,
>consumable and equipment solutions to high technology assembly
>industries, with the highest levels of technical support and
>customer service.
>
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