Peter

Look at the possibility of using conductive adhesive after reflow.

Regards

Richard Brennan
Manufacturing Support Manager
Health & Safety Manager
Aerial Facilities Ltd
Aerial House
Asheridge Road
Chesham
Bucks
HP5 2QD
01494 777000
Direct line
01494 777052

[log in to unmask]

See us at www.aerialfacilities.co.uk

 -----Original Message-----
From:   Peter Swanson [mailto:[log in to unmask]]
Sent:   Friday, September 12, 2003 9:57 AM
To:     [log in to unmask]
Subject:        [TN] LED Soldering Query

We have a customer who is looking at assembling some surface mount LEDs to a
FR-4 board. We are told that the parts will not stand conventional reflow
temperatures (they themselves are made with a LMP solder, and the lens is
temperature sensitive). At this stage, I don't know much more detail.

The query is whether he could print conventional paste, place the devices
and then reflow each joint individually, by using a robot. But a soldering
iron applied the paste will cause spitting, solder balls, etc.

Perhaps a thermode could be applied to the joint and a temperature ramp up
applied, which will safely reflow the paste, if such a thing exists and can
be mounted to a robot.

I would be interested in general thoughts on how to process these parts.
Maybe not even solder...

TIA,
Peter
--
--------------------------------------------------------
Peter Swanson           [log in to unmask]
INTERTRONICS               http://www.intertronics.co.uk
Tel: +44 1865 842842                Oxfordshire, England

INTERTRONICS is dedicated to providing quality material,
consumable and equipment solutions to high technology
assembly industries, with the highest levels of technical
support and customer service.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------