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September 2003

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Subject:
From:
Dave Chapman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 10 Sep 2003 12:23:08 -0500
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If short were all we look for that's correct but we look for opens and
%voiding as well.
Dave Chapman

-----Original Message-----
From: Dehoyos, Ramon [mailto:[log in to unmask]]
Sent: Wednesday, September 10, 2003 12:16 PM
To: [log in to unmask]
Subject: [TN] Self Align BGAs less radiation


        BGAs can be self aligned by having knobs at each corner of the part
and complementary dimples on the boards.        This has to be regulated by
IPC or other governing body so that each size of BGA would have a standard
dimple geometry. In this manner X-raying to check for alignment would not be
necessary,  and reduce the amoung of short defects.   It might decrease the
time spent on each BGA during XAI and resulting in less radiation to the
parts. The same thing can be done for QFPs, DIPs and others. They will not
vibrate out of aligmment during track travel trhough the SMT line. Just a
thought.
        Regards,
        Ramon

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