Hi Victor,
Have you considered hydro-scanning the PWBs to determine the physical size, shape and location of the suspected delamination of the PWBs?
If you are interested, there is a company named SAIC (Science Applications International Corp) who has scanning type systems to perform this type of non-destructive evaluation process? I have used SAIC's Ultra Image IV Scanning System with great success numerous times to confirm the delamination of multi-layer PWBs prior to performing the destructive physical analysis process. SAIC's is located in New London, CT, and their web-site is: http://www.saic.com/products/inspection
Also, John Mandeville, Senior Staff Engineer is an excellent SAIC technical contact who can provide you with a wealth of information on the subject. John's telephone number is 860-442-0100.
Best regards,
faz
-----Original Message-----
From: Victor Hernandez [mailto:[log in to unmask]]
Sent: Wednesday, September 03, 2003 12:12 PM
To: [log in to unmask]
Subject: [TN] PCB delamination Evaluation
Fellow TechNetters,
Are there any case studies out there that may apply to the following request.
Can varying degrees of delamination be identified with CSAM and correlated with x-ray imaging and followed up with
destructive cross section analysis. Is it possible to see the above stated artifact on a PCBA with PBGA package.
Given: The suspected delamination induced by excessive rework, Thermal Excursion and/or too high Assembly Process Profile.
Victor,
---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
******************************************
The information contained in, or attached to, this e-mail, may contain confidential information and is intended solely for the use of the individual or entity to whom they are addressed and may be subject to legal privilege. If you have received this e-mail in error you should notify the sender immediately by reply e-mail, delete the message from your system and notify your system manager. Please do not copy it for any purpose, or disclose its contents to any other person. The views or opinions presented in this e-mail are solely those of the author and do not necessarily represent those of the company. The recipient should check this e-mail and any attachments for the presence of viruses. The company accepts no liability for any damage caused, directly or indirectly, by any virus transmitted in this email.
******************************************
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
|