Hi TI-Doug, and IPC LF Listservers,

Thanks Doug, a Great Report.

TI's-Doug tried to post a note that I was copied on yet it didn't
come through. I don't believe the list can accept pdf attachments.


<Here's an article from Nikkei Electronics that describes the
<issue.  This article was published in the public domain in 2002.
<
<Best regards, Doug Romm

<Nikkei_Electronics_Cover_Story_2002.10.21.pdf


Sorry Listsevers I couldn't find the web link in the time
I allowed for my search and then sending this out to all.
-------------------------


So Brian in this case is more right than I, SHUCKS!!

This failure occured inside the package with  P turning into
Phosphoric Acid and assisting the migration of the small amount
of Silver on Gold Wire bond pads to cause interpackage shorting.
The report with 23 pages says a lot lot more.  Hope I got this
all right and condensed in speed reading. I kept looking for
"And where is the Silver?"

http://nepp.nasa.gov/docuploads/BFEFB06E-4931-44AB-
93738054D6B90ADC/Abstract_Use_of_Phosphorous_in_PEMs.doc

Tells a smidgen about Red P vs other forms of P.
 Note COTS in the above stands for Commercially Off The Shelf


This report does point out on a grande scale that sometimes
the best of intentions and reasonable science  i.e P to replace
Bromine to solve an engineering/etc problem can create other
technical / reliability problems.

Put a little silver on the surface of the Printed Circuit Board,
or in proximity, bring this package material close to the surface
of the circuit board, add flowers of sulfur or sulphur to your
environment, some heat, 85% humidity, plus and maybe.


Again TI-Doug thanks, it was fun reading.

YiEngr, MA/NY DDave

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