LEADFREE Archives

September 2003

Leadfree@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Antw: [LF] AW: [LF] IPC Seeking Industry Experts on Tin Whiskers
From:
Guenter Grossmann <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Mon, 22 Sep 2003 13:46:02 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (32 lines) 
Lieber Herr Dittes

Vielen Dank für die Mail
Im Moment kann ich da nicht extrem viel dazu beitragen. AAAAber ich hätte eine Frage: Haben Sie Daten betreffend Haftung von Moldcompounds?
Insbesoondere interessieren mich Haftung = f(Temperatur), Haftung = f(Füllstoffgehalt)

Mit besten Grüssen

G. Grossmann



EMPA
Swiss Federal Laboratories  for Materials Testing and Research
Centre for Reliability
Guenter Grossmann,  Senior Engineer

8600 Duebendorf
Switzerland

Phone: xx41 1 823 4279
Fax :     xx41 1 823 4054
mail:     [log in to unmask]

-------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-------------------------------------------------------------------------------

ATOM RSS1 RSS2