Sorry, I find this hard to believe. If 2% Ag formed dendrites as easily
as this appears to, then we are in REAL trouble. Surely, it would have
been published all over the place. Please remember that the Ag is held
in tin-rich intermetallics and is not likely to be in a free state on
the surface. It sounds to me like the lead frame or whatever was silver
plated.

Brian

MA/NY DDave wrote:
> Hi Brian, Steve, and IPC LF Listserves,
>
> My guess Brian is that those that caused the ruckus are using
> 2%+ Ag in the solder or Im-Ag as a PCB finish.
>
> Steve reading that link leaves a lot of questions since some of
> these problems are difficult to solve, the problem may have been
> caused by other factors yet quite often the manufacturers and
> suppliers make an agreement and them move on to something else
> that makes everyone temporarily happy. Not the best of science yet
> it happens all the time with piles of emotions involved. Hey to
> get rid of an unsolvable highly political IR problem me and my
> buds moved to another resistor manufacturer, and the problem
> gently settled in the dust.
>
> I will next read TI-Doug's note and reference.
>
> This isn't exactly a Lead Free subject yet Tin Whiskers are a coming
> and a lot of parallels exist with what we are going to see in this
> new LeadFree and Lead37Full era.
>
> YiEngr, MA/NY DDave
>
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