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September 2003

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Subject:
Re: Potential Problems with Mold Compound
From:
MA/NY DDave <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Fri, 19 Sep 2003 13:23:08 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (18 lines) 
Hi Doug, Steven, Brian and IPC-LF Listserves,

Doug it is great that TI has steered away from this material
and thanks for letting me know where it is in the system.

Yet do you have a technical report anywhere that describes
exactly what was happening.

YiEngr, MA/NY DDave

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