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September 2003

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Subject:
Potential Problems with Mold Compound
From:
"Creswick, Steven" <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Fri, 19 Sep 2003 09:55:05 -0400
Content-Type:
text/plain
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text/plain (17 lines) 
Had anyone seen this yet.  It just came to my attention this morning.

<http://www.maxim-ic.com/TechSupport/QA/Reliability/SumitomoNote.pdf>

I wonder just how much (other) product has been manufactured with this particular mold compound, and how many under-explained failures it will generate?


Steven Creswick - Gentex Corporation

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