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Subject:	Re: XRF Standards for Pb contamination on IC leads
From:	Sara Hardy-Baloun <[log in to unmask]>
Reply To:	(Leadfree Electronics Assembly Forum)
Date:	Tue, 16 Sep 2003 13:59:41 +0100
Content-Type:	text/plain
Parts/Attachments:	text/plain (41 lines)

Similarly, I have a concern re traces of Pb "wiped onto" components during
post plating processing.  e.g. during form step of trim/form of leaded
components.  How do we measure that?  One has to assume there will be some
kind of contamination introduced since for the foreseeable future both Sn/Pb
and Pb-free lead finish will both processed on the same equipment/tools.
Sara Hardy-Baloun, ATL

-----Original Message-----
From: Bev Christian [mailto:[log in to unmask]]
Sent: 16 September 2003 13:52
To: [log in to unmask]
Subject: [LF] XRF Standards


What are people doing for XRF thickness standards for lead free?  Just
saying to heck with new standards, since the amount of elements other than
tin (in SAC alloys) is so low?
Bev Christian
Research in Motion

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