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September 2003

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Subject:
From:
MA/NY DDave <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Mon, 29 Sep 2003 08:06:00 -0500
Content-Type:
text/plain
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text/plain (62 lines)
Hi Jean-Paul, and IPC LF Listservers,


>Hello Dave,
>SMTAI had a one-day lead-free symposium, which I thought was very good.
>Several other papers on packaging also had lead-free reliability data for
>different types of packages.  I believe you can get the Proceedings (CD)
>from the "bookstore" at smta.org, or contact their office to ask about it.
>No breakthrough (in my opinion) but many good pieces that will be useful in
>cooking up lead-free recipes.

Thanks, I can also get it eventually on-line since I am a member.

When I heard Sandia-Paul announce this in June, I was very concerned that
many of the talks might just be old papers brushed off a little.


>NPL (UK) also presented their shear test conditions and test results
>which show that, at high stress (> ~ 25 MPa), SAC creep rates can be
>higher than for SnPb.  There previously was a forum discussion on
>that topic, with at least 3 independent tests and analysis of test
>data that seem to confirm that trend.

Which SnAgCu combination did they use?
Did they know the grain structure?
How about temperature?
Did they show comparative graphs at some points from 1MPa to >25

I notice you said "can" be higher?
 (Maybe I am reading something into this simple word)?

Well I have to think about the significance of (> 25 MPa) which I think
is about 25x10Atm or 25x145psi in a real life environment and what
SnPb is doing at those stress levels.

Did they discuss the real life environment significance?

If WernerE reads this or G.Grossman, or Aherns maybe they will comment.
They are on top of this stuff far better than me.


>PS: all my apologies for my previous e-mail that went out blank when I
>inadvertendly pressed the send key.

Well at least thank yourself they were blank. I have clicked send
with wrong spellings, thinkings, etc.  HOW Embarrassing not to say
bad for Good Will.

Thanks Again Jean-Paul,

And I hope Werner, Ahern, Grossman, etc will comment.

YiEngr, MA/NY DDave

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