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| From: | |
| Reply To: | (Designers Council Forum) |
| Date: | Mon, 29 Sep 2003 10:10:43 -0700 |
| Content-Type: | text/plain |
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Charles, we are designing a footprint for a 180-pin BGA with 0.8mm pitch.
The data sheet recommends .020" for the vias; however, if we use that size,
we cannot get a 5 mil trace through with 5 spacing (it equals 3 mil spacing
trace-to-via). Are your vias smaller than .020" dia on the internal layers?
-----Original Message-----
From: ext Charles J Wills [mailto:[log in to unmask]]
Sent: 29 September, 2003 08:16 AM
To: [log in to unmask]
Subject: Re: [DC] .8mm BGA
Fred-
I've just finished a board with a "Microstar" BGA-240 with 0.8mm pitch.
I used 5mil trace and spacing with a 20mil via pad, 11mil drill . The
PCB is 4 layers (2 signal and 2 power/ground) and is 0.062" thick. So
far the PCB house hasn't had a problem with fabrication. Escape routes
can be tricky with 4 layers, but it worked.
Charles Wills
On Fri, 26 Sep 2003 13:06:37 -0400 Fred Dark <[log in to unmask]> writes:
> Hello all, Sorry.... Its a .8mm BGA... I would like to know if anyone
> can
> tell me what trace width, spacing and via size(pad,drill & anti-pad)
> to use
> with this footprint... All input is well appreciated, Thanks
>
> Regard's, Fred Dark Jr.
>
>
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