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Dear Engelmaier
I am sorry for delay to discuss this topic.Would please tell me what kind of preheater should be used?I mean what the preheater looks like, a bake oven,IR burner with a cover or sth else?
I talked about the PTH component including surface pad,we use thermal-pad designs.
The board with ENIG surface finish usually have hand soldering problems.(Please see attacted files).Somebody suggest us use a bigger pad size,is it all right?
Is there any limitation of connected layers?
Regards
Don
Huawei
----- Original Message -----
From: "Werner Engelmaier" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, June 17, 2003 12:19 AM
Subject: Re: [TN] High heat sink board hand soldering
> Nee how Don,
> 1. I would preheat even higher, 110 to 115C, measured on the board.
> 2. I take it you talk surface pad, are your internal pads thermal-pad designs?
> 3. If you have good Cu plating and no further soldering operations, and no
> severe temperature cycling [in test or operation] 25 to 50% fill should be o.k.
>
> Regards,
> Werner Engelmaier
>
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