We have a customer who is looking at assembling some surface mount LEDs to a
FR-4 board. We are told that the parts will not stand conventional reflow
temperatures (they themselves are made with a LMP solder, and the lens is
temperature sensitive). At this stage, I don't know much more detail.

The query is whether he could print conventional paste, place the devices
and then reflow each joint individually, by using a robot. But a soldering
iron applied the paste will cause spitting, solder balls, etc.

Perhaps a thermode could be applied to the joint and a temperature ramp up
applied, which will safely reflow the paste, if such a thing exists and can
be mounted to a robot.

I would be interested in general thoughts on how to process these parts.
Maybe not even solder...

TIA,
Peter
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Peter Swanson           [log in to unmask]
INTERTRONICS               http://www.intertronics.co.uk
Tel: +44 1865 842842                Oxfordshire, England

INTERTRONICS is dedicated to providing quality material,
consumable and equipment solutions to high technology
assembly industries, with the highest levels of technical
support and customer service.

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