Looks like our problem with PCB solder mask separating after wave was caused
by too much torque on screw used to hold down heatsink. Screw was torqued
and then peelable mask was applied, after removal post wave delamination
occurred. We set a hand tight limit on the scew/nut and the problem went
away. I am still concerned with adhesion though and will address with board
house since this is first time we see this issue and have many similar
assemblies.
Thank you all for your assistance.
Dave Chapman
-----Original Message-----
From: David Douthit [mailto:[log in to unmask]]
Sent: Sunday, August 10, 2003 11:43 PM
To: [log in to unmask]
Subject: Re: [TN] Cleaning of BGA sites after component removal;Re: [TN]
Theattack of the Peelable Mask; [TN] SEI resistor not adhering on
boardside
Larry,
Trying to save money no matter how much it costs is pandemic.
David A. Douthit
Manager
LoCan LLC
Larry Russell wrote:
> Hello All,
>
> Three new sets of reliability problems in a day? Maybe the trend for
always cheaper PCB's includes some quality issues?
> Don't guess this is the last time getting more for less causes problems.
> Personal results may vary.
>
> Larry Russell
> CWI.com.tw
> -----Original Message-----
> From: Tempea, Ioan [mailto:[log in to unmask]]
> Sent: Friday, August 08, 2003 11:45 PM
> To: [log in to unmask]
> Subject: [TN] Cleaning of BGA sites after component removal
>
> Hi Technos,
>
> I don't know why, but lately we get more BGA rework contracts. Some
> customers come with batches of 40 boards, which I find huge for rework
lots.
>
> And we noticed that it takes a lot of time and solder wick to clean the
> pads. Not to mention the scratched solder mask and the pads coming out of
> the substrate.
>
> What other cleaning methods or tools are there?
>
> Many thanks,
> Ioan
>
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