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August 2003

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Subject:
From:
"Brown, William G" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 6 Aug 2003 15:54:32 -0400
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Hi All,

I was wondering if anyone could point me towards any information (papers,
studies, etc.) regarding the impact of conductive via fill on via
reliability.  I've done some searched but there doesn't seem to be much
information on the topic.  Of particular interest is the planarization
process, temperature cycling, over plating and uses for applications other
than via-in-pad.

Thanks,
Bill

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