Dear TechNeters,

We are experiencing some solderproblems (fillet height) with a High Voltage
1206 resistor, visually it appears to be a wetting problem but when perform
rework on the solderjoint the solder flows without any problem.
The reflow profile we use should be right according to the paste specs
(Sn/Pb) and all of the other components are soldered beautifully.
So the problem would be the component (oxidation) or the flux activity
isn't sufficient.

I looked at the datasheet of the component and saw that we can choose from
6 different termination materials
-       Palladium Silver,
-       Palladium Gold,
-       Platinum Silver,
-       Platinum Gold,
-       Gold,
-       Nickel barrier,
According to the datasheet the solder termination is always Sn62.

We are using the Palladium Silver type

I was wondering and hope that someone can tell me why a manufactor would
use that many termination materials while he uses the same
soldertermination for all types.
Other questions that come to mind is, can a combination of these alloys
with the tin cause a decrease in shelf live (oxidation).
And is it wise for us to use another termination material.

Hilbrand

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