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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 28 Aug 2003 17:05:32 -0500 |
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Hi Kenny! I have sort of a contaminating answer! The introduction of other
elements into your wave solder pot is going to be a function of the
diffusion kinetics of the specific element, the temperature/speed/ etc of
your wave solder bath, and the amount of assembly board feet you process
through the wave. No different than what you deal with for finishes today -
the amount of silver and gold contributed from the new immersion finishes
is small and could slowly build up over time. Some "contaminating" metals
are lost/removed during de-drossing operations so as long as you are
monitoring your wave solder bath composition you shouldn't get surprised
and exceed the contamination limits listed in JSTD-001. Just another one of
those "Pbfree" issue we need to address/understand.
Dave
"Bloomquist, Ken"
<ken.bloomquist@G To: [log in to unmask]
D-AES.COM> cc:
Sent by: TechNet Subject: Re: [TN] Immersion Silver vs. White Tin
<[log in to unmask]>
08/28/2003 03:07
PM
Please respond to
"TechNet E-Mail
Forum."; Please
respond to
"Bloomquist, Ken"
I have sort of a contaminating question. If you are using Immersion Silver
on PWB's that are going to be wave soldered will the silver eventually
contaminate the balance of the tin/lead in the solder pot?
KennyB
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