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August 2003

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Subject:
From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 28 Aug 2003 09:21:11 -0700
Content-Type:
text/plain
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text/plain (107 lines)
        Paul:
        What would the preheat be?
        Regards,
        Ramon

> -----Original Message-----
> From: Stolar, Paul W [SMTP:[log in to unmask]]
> Sent: Thursday, August 28, 2003 9:28 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] Cracking Ceramic SMT Capacitors
>
> Is your preheat correct. We eliminated our shorting/cracked caps by
> improving our preheat process for Reflow.
>
>
>
> Paul Stolar
>
> Materials Engineer
>
> Houston Technology Center
>
> Baker Atlas
>
> 713-625-5376
>
> 713-625-4949 (fax)
>
> -----Original Message-----
> From: Bob Perkins [mailto:[log in to unmask]]
> Sent: Wednesday, August 27, 2003 6:42 PM
> To: [log in to unmask]
> Subject: [TN] Cracking Ceramic SMT Capacitors
>
>
>
> Cracking Ceramic SMT Capacitors
>
>
>
> " Is anyone else seeing an increase in the number of cracked and shorting
> ceramic chip capacitors?  In our experience as a contract manufacturer we
> have, in the past, seen the occasional instance of ceramic capacitors
> cracking and shorting out. The cause of this problem is generally obvious,
> as it is isolated to components situated in areas of the PCB that are
> subject to flexing.
>
>
>
> Recently however we have seen more frequent instances of this problem;
> very often in areas of the board that should not be experiencing any
> appreciable flex. Our process has not changed and neither have our sources
> of these components. Have chip capacitors themselves become more fragile?"
>
>
>
>
> Rod Lafond
>
> Manager, Quality Assurance and Technical Training
>
> APEX-Micro Manufacturing Corporation
>
> [log in to unmask] <mailto:[log in to unmask]>
>
>
>
>
>
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