Hi Larry! MIL-STD-202, method 208 actually points you to using JSTD-002B
(note the newly released revision status) so if your customers are
requesting you use MIL-STD-202 then you are using 002B!  It is an urban
myth that the MIL STD solderability test is tougher than the IPC
solderability test - especially since they are the same test! The
solderability committee (made up of the IPC, EIA, and JEDEC groups) is also
working on revision of the MIL-STD-750 and MIL-STD-883 specifications to
point to 002B in a similar manner as MIL-STD-202. The committee is also
working with the IEC solderability specification group and we may
eventually have a global solderability specification before we all retire
(now don't hold your breath but the groups are working very hard with that
purpose in mind)! Also keep in mind that the purpose of any solderability
test is to measure the robustness of the solderable finish -not to be a
one-to-one predictor of how that finish will work in your manufacturing
process. I know that sounds hypocritical but no solderability specification
can replicate the multitude of times/temperatures/flux compositions that we
use in the industry soldering processes and therefore having a
methodology/testing procedure that demonstrates the robustness of a
solderable finish is more useful to the industry. You, the user, can decide
how that given solderability measure fits your manufacturing process. Have
the solderability committees attempted to make the solderability test
representative/predictive of  real life manufacturing? - absolutely, but it
is more important that a solderability test be consistent and repeatable so
that the test results can be applied in useful, universal manner.

Dave Hillman
JSTD-002 Chairman
[log in to unmask]



                      Larry Koens
                      <[log in to unmask]        To:       [log in to unmask]
                      COM>                     cc:
                      Sent by: TechNet         Subject:  [TN] solderability testing of SMT components
                      <[log in to unmask]>


                      08/22/2003 11:13
                      AM
                      Please respond to
                      "TechNet E-Mail
                      Forum."; Please
                      respond to Larry
                      Koens






Technetters,
How does your Quality department test components for solderability? Do they
still test to the MIL-STD-202, MIL-STD-750D which is a soldering iron or
solder pot test? I'm looking to have my company test to IPC/EIA J-STD-002A
4.2.5 "test S- surface mount process simulation test." This test basically
is placing solderpaste on ceramic and running it through the reflow oven.
My thought is that this is how these components are going to be used, so
this test better reproduces the actual world.

But, many component manufactures still use one of the MIL standards. As you
all know,  components will solder much better using the MIL test then the
IPC test.I can see there is gonna be difficulty in getting them to accept
them back as defective. How do you handle this? Do you test to the MIL test
because thats what the manufacture does? How would you handle the issue of
the component passing the MIL test but failing the IPC test Knowing that
the IPC test reflects your manufacturing process?

Larry


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