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August 2003

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Subject:
From:
Carlr Ray <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 14 Aug 2003 11:15:20 -0500
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Hello All,
 I have a question about Entek and preferred types of probes for ICT
Testing?
 Also I have an issue where we are discussing the need to solder test
pads or leave them unsoldered. Currently we are experiencing several ICT
problems with solder test pads. We have deflected test probes, excess
flux contamination and a high amount of false failures. We are using
No-Clean Paste.
 As usual any feedback is appreciated.

Carl Ray
Sr. Manufacturing Engineer
Huntsville, AL 35807
Phone: 256-882-4800 ext. 8845
Cell: 256-990-1990

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