Wild wild west in Iowa? I am sure it just like I treat someone with
"Aluminum wirebondable OSP + silver"....
jk
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Doug Pauls
>Sent: Tuesday, August 12, 2003 8:26 AM
>To: [log in to unmask]
>Subject: Re: [TN] Black pad
>
>
>Heavens yes. You should have seen the LAST time Dave
>suggested something like that. The manufacturing floor folks
>were after him like villagers from an old Frankenstein movie.
>Took hours to quiet them down and weeks to get the soot marks
>cleaned from all of the torches they were carrying. Very ugly.
>
>Doug Pauls
>
>
>
>
>
>
> Dave Hillman
>
>
> <ddhillma@rockwellc To:
>[log in to unmask]
>
> ollins.com> cc:
>
>
> Sent by: TechNet Subject: Re:
>[TN] Black pad
>
> <[log in to unmask]
>
>
> pc.org>
>
>
>
>
>
>
>
>
> 08/12/2003 07:14 AM
>
>
> Please respond to
>
>
> "TechNet E-Mail
>
>
> Forum."; Please
>
>
> respond to ddhillma
>
>
>
>
>
>
>
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>
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>
>
>Hi Per-Erik! Yes, I have found that mechanical abrasion can be
>used to restore BGA pads which have been impacted by black pad
>but I didn't offer that method of restoration as a solution -
>the amount of collateral damage to the soldermask around the
>pad sites usually results in bridging defects during the
>component replacement phase. And I don't seem to be very
>popular on the manufacturing floor when I suggest that we need
>to abrade every pad on a +500 I/O BGA!
>
>Dave
>
>
>
> Tegehall Per-Erik
>
> <per-erik.tegehal To:
>[log in to unmask]
>
> [log in to unmask]> cc:
>
> Sent by: TechNet Subject: Re:
>[TN] Black pad
>
> <TechNet@listserv
>
> .ipc.org>
>
>
>
> 08/12/2003 04:27
>
> AM
>
> Please respond to
>
> "TechNet E-Mail
>
> Forum."; Please
>
> respond to
>
> Tegehall Per-Erik
>
>
>
>
>
>
>
>Hi Werner and Dave,
>
>The black colour on pads with the defect "black pad" is, in
>most cases, due to an enrichment of nickel phosphide that
>occurs during the plating of immersion gold. Some nickel is
>always etched from the surface in this process but if the
>process is not under control too much nickel may be etched
>away and the phosphorus in the electroless nickel will be
>enriched as NiP in the interface between nickel and gold. I
>believe it will be very difficult to remove it chemically. I
>think I have read somewhere that that someone removed it
>mechanically and then soldered directly to the nickel surface.
>A fresh electroless nickel surface has moderate solderability
>and with the right soldering process it might be possible to
>solder to it.
>
>Per-Erik Tegehall
>IVF, Sweden
>
>-----Ursprungligt meddelande-----
>Från: Dave Hillman [mailto:[log in to unmask]]
>Skickat: den 11 augusti 2003 21:31
>Till: [log in to unmask]
>Ämne: Re: [TN] Black pad
>
>
>Hi Werner! We have tried to use our ROSA system to
>electrochemically reduce the degraded nickel surfaces with no
>success (nickel oxide/corroded nickel is tough stuff!). I have
>not heard of anyone being able to restore a "black pad"
>surface successfully without having collateral damage to
>adjacent regions of the printed wiring assembly.
>
>Hey Rudy S. - is there a chemical treatment potential/possibility?
>
>Dave Hillman
>Rockwell Collins
>[log in to unmask]
>
>
>
> Werner Engelmaier
> <[log in to unmask] To:
>[log in to unmask]
> OM> cc:
> Sent by: TechNet Subject: [TN] Black pad
> <TechNet@listserv
> .ipc.org>
>
>
> 08/11/2003 02:09
> PM
> Please respond to
> "TechNet E-Mail
> Forum."; Please
> respond to
> Engelmaier
>
>
>
>
>
>
>Hi All,
>Are there any successful rework procedures for 'black pad'?
>
>Werner Engelmaier
>
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