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August 2003

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From:
Larry Koens <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 7 Aug 2003 15:18:20 -0500
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Techneters
Steve was good enough to post a picture of my problem on his website. It's titled "solderball beside crystal." 
This crystal has two Castellated terminations at each end of the component. These two terminations are tied together underneath the component. Our pads and paste are per the manufacture's suggestions (not that is always a good thing)But as you can see, we have a solderball problem. My feeling this that the paste is getting squeezed out under the component and forming the solderballs. What type of paste aperture reductions do you all use for this type of component that really doesn't have any standoff height? I know most companies use a standard 10% reduction. Just not sure if it's enough. 
thanks,

Larry Koens
E.I. Microcircuits

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