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August 2003

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 6 Aug 2003 15:25:13 EDT
Content-Type:
text/plain
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text/plain (23 lines)
Hi Yannick,
Just one question: WHY?

In a message dated 08/06/2003 13:23:13, [log in to unmask] writes:
> I would like to calculate the solder fillet left on the pad after a
>reflow( does it change depending on the component of the pad?), does anyone
>know the formula to do that or knows a web site that describ how to do it?
>Yannick

Regards,
Werner Engelmaier

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