Hi Yannick,
Not really sure what you are truly asking, or why you want to do perform the calculation, but if you are interested in knowing how to calculate the "total area or square inches" of a solder fillet, which is left on one side of the PWB and is used to attach the lead wire to the solder pad on the surface of one side of a PWB, this is the formula:
A = ( ( /(4 ((2)) ( (dH + dI) ( (dP - dI)
Where: ( = 3.14159
dH = is the unsupported hole diameter in PWB, inches
dI = is the lead wire diameter, inches
dP = is the pad diameter on PWB surface, inches
The above formula does not consider the amount of solder in the hole, simply because the hole is unsupported without a PTH copper barrel. If you need to know the "total area or square inches" for a PTH with solder fillets on both sides of a multi-layer PWB, which also includes the area of the solder-plug in the PTH barrel, the formula is significantly different.
Lastly, use the above formula with caution simply because the results of the area calculation can "vary greatly" depending upon the soldering process that is used and the consistency of that process in producing multiple solder joints.
Regards,
faz
-----Original Message-----
From: Yannick Brisson [mailto:[log in to unmask]]
Sent: Wednesday, August 06, 2003 1:24 PM
To: [log in to unmask]
Subject: [TN] solder fillet
Hi,
I would like to calculate the solder fillet left on the pad after a
reflow( does it change depending on the component of the pad?), does anyone
know the formula to do that or knows a web site that describ how to do it?
Thank You
Yannick
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