TECHNET Archives

August 2003

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Dave Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 28 Aug 2003 14:17:47 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (138 lines)
Hi Jim! We have done a bunch of testing and have found that the immersion
silver finish does not impact the solder joint reliability for a controlled
soldering process. We published the BGA data at the IPC APEX 2000 meeting
in Long Beach (the paper should be listed in the proceedings). We have also
been producing an immersion silver assembly for 10 years for a military
customer with no issues. Nothing solders like solder but immersion silver
isn't too far behind.

Dave Hillman
Rockwell Collins
[log in to unmask]




                      "Marsico, James"
                      <James.Marsico@DP        To:       [log in to unmask]
                      .AIL.COM>                cc:
                      Sent by: TechNet         Subject:  Re: [TN] Immersion Silver vs. White Tin
                      <[log in to unmask]>


                      08/28/2003 11:59
                      AM
                      Please respond to
                      "TechNet E-Mail
                      Forum."; Please
                      respond to
                      "Marsico, James"






Just out of curiosity, does the immersion silver effect long term
reliability of tin-lead solder joints?

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879


        -----Original Message-----
        From:   Dave Chapman [SMTP:[log in to unmask]]
        Sent:   Thursday, August 28, 2003 12:53 PM
        To:     [log in to unmask]
        Subject:        Re: [TN] Immersion Silver vs. White Tin

        Agreed, Immersion Silver was a drop in replacement both at reflow
and wave.
        Silver was lower cost or same as HASL. Only caution, the joints do
look
        different than HASL boards so education rather than rejection is
the
word of
        the day.

        As with all alternate finish boards handling is important, hands
off
the
        board, slip sheets needed on only the top and bottom boards  since
the
        finish is actually below the surface of the solder mask so no big
risk of
        scratching) in vacuum sealed bags, remove from packaging just
before
        processing, don't let sit on the shelf unless fully processed,
don't
wait
        3-4 weeks to run through the wave after SMT because you may see
tarnish,
        although solderability is still good, statistically the sooner
processed the
        better.

        White Tin we had to go to higher temp profile and watch every step.
        Congratulations on going to Lead Free PCB's
        Dave Chapman

        -----Original Message-----
        From: Bill DeCray [mailto:[log in to unmask]]
        Sent: Thursday, August 28, 2003 11:34 AM
        To: [log in to unmask]
        Subject: Re: [TN] Immersion Silver vs. White Tin


        Immersion silver would be the best choice

        Highest Regards
        William W. DeCray III
        Sales Engineering Manager
        Waytec Electronics Corp.
        Phone: (434) 237-6391 Ext 115
        Fax:   (434) 237-1324
        Cell:  (434) 851-6115
        E-mail [log in to unmask]
        Website www.waytec.com


        -----Original Message-----
        From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
        Sent: Thursday, August 28, 2003 11:31 AM
        To: [log in to unmask]
        Subject: [TN] Immersion Silver vs. White Tin

        Hi All!

        Got a customer that's calling out on the fab drawing, either
Immersion
        Silver
        or White Tin for a board finish.

        Me, not having great deal of experience with either one (yet), am
        wondering
        if I had to choose, which one would I choose?

        Have any of you worked with both, and have a preference of one over
the
        other? Why?

        As always, thanks in advance!

        -Steve Gregory-

---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2