Larry,
Good points. We only use the ole "dip and look" when really pushed to the wall. And it is a tad difficult to do it for 0402's and filters with solderable pads of 0.5 mm x 0.5 mm!
We use a wetting balance outfitted with a globule block and expect wetting forces to be > 25-33% of theoretical maximum and want a T2/3FMax < 1 second. We have had "fights" with suppliers because the wetting balance is not in J-STD-002A and J-STD-003 (I forget the rev) as a test with defined pass/fail criteria. I am using the IEC solderability specs more and more and the Far Eastern suppliers seem less likely to baulk at me using the balance, although there are still issues with my pass/fail criteria. Obviously this device is not used for BGAs and CSPs. For those we use the IPC S test.
regards,
Bev Christian
Research in Motion
-----Original Message-----
From: Larry Koens [mailto:[log in to unmask]]
Sent: August 22, 2003 12:31 PM
To: [log in to unmask]
Subject: Re: [TN] solderability testing of SMT components
Carlr,
Our customers want the product build to IPC-A-610, class 2 and yes they were qualified by the customer. Problem is that many of our customers qualify their products in a lab using roll solder and a iron, Not real world. I really have two issues, one is on components that always fail solderability and others who randomly fail.
Larry
-----Original Message-----
From: Carlr Ray [mailto:[log in to unmask]]
Sent: Friday, August 22, 2003 11:21 AM
To: [log in to unmask]
Subject: Re: [TN] solderability testing of SMT components
Larry,
Couple of questions for you.
1. What is your customers specification for workmanship?
2. Was the component vender qualified by your customer and if so how?
You are correct in the fact that the supplier will probably not accept
that these parts are bad. I have seen in the past where component
suppliers will try to "dis-qualify" your process because their
components are not performing. This can be a touchy area, good luck.
>>> [log in to unmask] 8/22/2003 11:13:33 AM >>>
Technetters,
How does your Quality department test components for solderability? Do
they still test to the MIL-STD-202, MIL-STD-750D which is a soldering
iron or solder pot test? I'm looking to have my company test to IPC/EIA
J-STD-002A 4.2.5 "test S- surface mount process simulation test." This
test basically is placing solderpaste on ceramic and running it through
the reflow oven. My thought is that this is how these components are
going to be used, so this test better reproduces the actual world.
But, many component manufactures still use one of the MIL standards. As
you all know, components will solder much better using the MIL test
then the IPC test.I can see there is gonna be difficulty in getting them
to accept them back as defective. How do you handle this? Do you test to
the MIL test because thats what the manufacture does? How would you
handle the issue of the component passing the MIL test but failing the
IPC test Knowing that the IPC test reflects your manufacturing process?
Larry
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