Trials have been conducted on the use of lead-free alloys like tin/silver/copper, tin/copper and the nickel loaded material as outlined in the text from the Experience discussed previously that I was running in Brighton.
The reason that HASL is not discussed is that the process has generally been less popular in the last few years due to issues associated with the assembly of some surface mount parts. Please lets not get in to the long debate about surface finishes. However, many of the problems associated with HASL is the time spent to optimise the process for different designs that is not taken.
Reuven I will send you a guide to surface finishes.
Many thanks
Bob Willis
2 Fourth Ave, Chelmsford, Essex, CM1 4HA
Tel: 01245 351502
Fax: 01245 496123
Mobile: 07860 775858
Email: [log in to unmask]
Web: www.leadfreesoldering.com
Web: www.bobwillis.co.uk
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Reuven ROKAH
Sent: 27 August 2003 07:41
To: [log in to unmask]
Subject: Re: [LF] Sn-3Ag-0.5Cu
Hello All,
Thanks for All the replys,
According JEITA (as per bellow) , the above alloy is recommended across the
line (Reflow - solder paste, wave - ingots, hand soldering wire and
components as well).
My question is why not to change the HASL from 63/37 Sn/Pb to Sn-3Ag-0.5Cu
, the same as the Ingot alloy in the wave soldering bath.
The HASL process is relatively simple comparing to the other chemical /
electrolytic processes (not for HDI PCBs).
Regards
Reuven
The following types of solder are recommended.
n Board assembly:(Recommended) Sn-3Ag-0.5Cu
• Reflow: Sn-3Ag-0.5Cu > Sn-Ag > Sn-Zn-Bi
• Wave: Sn-3Ag-0.5Cu > Sn-Cu
• Hand: Sn-3Ag-0.5Cu
n Components:
• Solder balls (Recommended): Sn-3Ag-0.5Cu
• Land finish (Recommenced): Plating/Au, Solder precoat/Sn-3Ag-0.5Cu
Best Regards
ROKAH Reuven
Chief Engineer
ECI Telecom LTD.
Operations Division
30 Hasivim St. Petah-Tikva 49517
ISRAEL
Tel: 972-3-9266734 Mobile:972-55-786734
Fax: 972-3-9266480
e mail: [log in to unmask]
Bob Willis
<[log in to unmask] To: [log in to unmask]
O.UK> cc:
Sent by: Subject: Re: [LF] Sn-3Ag-0.5Cu
Leadfree
<[log in to unmask]
G>
26/08/2003 16:33
Please respond
to "(Leadfree
Electronics
Assembly
Forum)"; Please
respond to Bob
Willis
No we are missing the point here the question was what is the most common
PCB surface finish, there is a reference to levelling. I would suggest that
hot air levelled boards are not the most common finish for lead free in
Japan?
Or is this just a translation thing?
Although a little old now IPC does have a couple of technology roadmaps
from
Japan they were offering that does have finish data for lead free from
other
surveys of the industry, Kay I think covered ii in her survey in Europe as
well.
Bob Willis
2 Fourth Ave, Chelmsford, Essex, CM1 4HA
Tel: 01245 351502
Fax: 01245 496123
Mobile: 07860 775858
Email: [log in to unmask]
Web: www.leadfreesoldering.com
Web: www.bobwillis.co.uk
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Reuven ROKAH
Sent: 26 August 2003 14:27
To: [log in to unmask]
Subject: [LF] Sn-3Ag-0.5Cu
Hello LF Forum
As I understood from JEITA Roadmap, the above alloy is the most recommended
one.
Can anyone inform his experience with PCBs finished with Sn-3Ag-0.5Cu and
the how the finish process is done (by hot leveled air?).
Best Regards
Reuven
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