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| Reply To: | (Leadfree Electronics Assembly Forum) |
| Date: | Wed, 27 Aug 2003 09:40:56 +0300 |
| Content-Type: | text/plain |
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Hello All,
Thanks for All the replys,
According JEITA (as per bellow) , the above alloy is recommended across the
line (Reflow - solder paste, wave - ingots, hand soldering wire and
components as well).
My question is why not to change the HASL from 63/37 Sn/Pb to Sn-3Ag-0.5Cu
, the same as the Ingot alloy in the wave soldering bath.
The HASL process is relatively simple comparing to the other chemical /
electrolytic processes (not for HDI PCBs).
Regards
Reuven
The following types of solder are recommended.
Board assembly:(Recommended) Sn-3Ag-0.5Cu
• Reflow: Sn-3Ag-0.5Cu > Sn-Ag > Sn-Zn-Bi
• Wave: Sn-3Ag-0.5Cu > Sn-Cu
• Hand: Sn-3Ag-0.5Cu
Components:
• Solder balls (Recommended): Sn-3Ag-0.5Cu
• Land finish (Recommenced): Plating/Au, Solder precoat/Sn-3Ag-0.5Cu
Best Regards
ROKAH Reuven
Chief Engineer
ECI Telecom LTD.
Operations Division
30 Hasivim St. Petah-Tikva 49517
ISRAEL
Tel: 972-3-9266734 Mobile:972-55-786734
Fax: 972-3-9266480
e mail: [log in to unmask]
Bob Willis
<[log in to unmask] To: [log in to unmask]
O.UK> cc:
Sent by: Subject: Re: [LF] Sn-3Ag-0.5Cu
Leadfree
<[log in to unmask]
G>
26/08/2003 16:33
Please respond
to "(Leadfree
Electronics
Assembly
Forum)"; Please
respond to Bob
Willis
No we are missing the point here the question was what is the most common
PCB surface finish, there is a reference to levelling. I would suggest that
hot air levelled boards are not the most common finish for lead free in
Japan?
Or is this just a translation thing?
Although a little old now IPC does have a couple of technology roadmaps
from
Japan they were offering that does have finish data for lead free from
other
surveys of the industry, Kay I think covered ii in her survey in Europe as
well.
Bob Willis
2 Fourth Ave, Chelmsford, Essex, CM1 4HA
Tel: 01245 351502
Fax: 01245 496123
Mobile: 07860 775858
Email: [log in to unmask]
Web: www.leadfreesoldering.com
Web: www.bobwillis.co.uk
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Reuven ROKAH
Sent: 26 August 2003 14:27
To: [log in to unmask]
Subject: [LF] Sn-3Ag-0.5Cu
Hello LF Forum
As I understood from JEITA Roadmap, the above alloy is the most recommended
one.
Can anyone inform his experience with PCBs finished with Sn-3Ag-0.5Cu and
the how the finish process is done (by hot leveled air?).
Best Regards
Reuven
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