Subject: | |
From: | |
Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Tue, 26 Aug 2003 14:33:32 +0100 |
Content-Type: | text/plain |
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No we are missing the point here the question was what is the most common
PCB surface finish, there is a reference to levelling. I would suggest that
hot air levelled boards are not the most common finish for lead free in
Japan?
Or is this just a translation thing?
Although a little old now IPC does have a couple of technology roadmaps from
Japan they were offering that does have finish data for lead free from other
surveys of the industry, Kay I think covered ii in her survey in Europe as
well.
Bob Willis
2 Fourth Ave, Chelmsford, Essex, CM1 4HA
Tel: 01245 351502
Fax: 01245 496123
Mobile: 07860 775858
Email: [log in to unmask]
Web: www.leadfreesoldering.com
Web: www.bobwillis.co.uk
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Reuven ROKAH
Sent: 26 August 2003 14:27
To: [log in to unmask]
Subject: [LF] Sn-3Ag-0.5Cu
Hello LF Forum
As I understood from JEITA Roadmap, the above alloy is the most recommended
one.
Can anyone inform his experience with PCBs finished with Sn-3Ag-0.5Cu and
the how the finish process is done (by hot leveled air?).
Best Regards
Reuven
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