HASL if it were referred to would be the PCB finish, some component
termination may be tin/silver/copper but tin would be the most common
alternative I would suggest if not tin/lead currently.
Bob Willis
2 Fourth Ave, Chelmsford, Essex, CM1 4HA
Tel: 01245 351502
Fax: 01245 496123
Mobile: 07860 775858
Email: [log in to unmask]
Web: www.leadfreesoldering.com
Web: www.bobwillis.co.uk
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Reuven ROKAH
Sent: 26 August 2003 14:45
To: [log in to unmask]
Subject: Re: [LF] Sn-3Ag-0.5Cu
Thanks Doug,
This article is of January 2000, is it still relevant?
Is the PCB finish is the same, and the process is HASL?
Best Regards
Reuven
"Romm, Doug"
<[log in to unmask]> To: [log in to unmask]
Sent by: cc:
Leadfree Subject: Re: [LF]
Sn-3Ag-0.5Cu
<[log in to unmask]
G>
26/08/2003 16:36
Please respond
to "(Leadfree
Electronics
Assembly
Forum)"; Please
respond to
"Romm, Doug"
Reuven,
My observations are:
Users in Japan are making plans to use the SnAgCu alloy that you mention
with 3% Ag.
However, this differs from the NEMI recommended alloy of Sn3.9Ag0.6Cu. The
NEMI recommendation can be seen in this press release:
http://www.nemi.org/newsroom/PR/2000/PR012400.html. Most Japanese users
appear to be focused on SnAgCu alloys with 3.5-4.0% Ag, rather than the 3%
Ag.
I don't have a comment on performance differences between the SnAgCu alloys
with 3% Ag versus 3.5-4.0% Ag, but I'm certain others will have inputs.
Best regards,
Doug Romm
Texas Instruments
-----Original Message-----
From: Reuven ROKAH [mailto:[log in to unmask]]
Sent: Tuesday, August 26, 2003 8:27 AM
To: [log in to unmask]
Subject: [LF] Sn-3Ag-0.5Cu
Hello LF Forum
As I understood from JEITA Roadmap, the above alloy is the most recommended
one.
Can anyone inform his experience with PCBs finished with Sn-3Ag-0.5Cu and
the how the finish process is done (by hot leveled air?).
Best Regards
Reuven
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